SRAM Design for 22-nm ETSOI Technology: Selective Cell Current Boosting and Asymmetric Back-Gate Write-Assist Circuit
As the semiconductor technology scales down, the read stability and write ability of a static random-access memory (SRAM) cell are degraded because of the increased mismatch among its transistors. Extremely thin silicon-on-insulator is one of the attractive candidates to reduce this mismatch, and it...
Saved in:
Published in | IEEE transactions on circuits and systems. I, Regular papers Vol. 62; no. 6; pp. 1538 - 1545 |
---|---|
Main Authors | , , , , , |
Format | Journal Article |
Language | English |
Published |
New York
IEEE
01.06.2015
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | As the semiconductor technology scales down, the read stability and write ability of a static random-access memory (SRAM) cell are degraded because of the increased mismatch among its transistors. Extremely thin silicon-on-insulator is one of the attractive candidates to reduce this mismatch, and it offers an independent back-gate control using a thin buried oxide. The implementation of back-gate control has recently attracted much interest to improve the read stability and write ability. In this paper, we propose a selective cell current (ICELL) boosting scheme (SIB) and an asymmetric back-gate control write-assist (ABC-WA) circuit. SIB enhances the read performance by selectively boosting ICELL of the SRAM cells. ABC-WA enhances the write ability by forward biasing the NMOSs at one side, which improves the write ability with reduction in the dynamic power overhead and without requiring a voltage generator. The proposed SRAM design improves the read performance and energy by 38.6% and 24.9%, respectively. |
---|---|
ISSN: | 1549-8328 1558-0806 |
DOI: | 10.1109/TCSI.2015.2416814 |