Novel Surface Impedance Modeling for Broadband Parameter Extraction of 3-D Interconnects

A novel boundary integral equation based method for modeling 3-D interconnects is proposed to compute the equivalent surface impedance in this letter. Differing from the traditional algorithm to discretize the conductor cross section, the proposed method only discretizes the contour of the conductor...

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Bibliographic Details
Published inIEEE microwave and wireless components letters Vol. 27; no. 1; pp. 7 - 9
Main Authors Zhao, Yu, Ling, Feng, Mao, Junfa
Format Journal Article
LanguageEnglish
Published IEEE 01.01.2017
Subjects
Boundary integral equation
Conductors
electric field integral equation (EFIE)
equivalent surface impedance
Impedance
Integral equations
Mathematical model
Method of moments
Semiconductor process modeling
Surface impedance
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Summary:A novel boundary integral equation based method for modeling 3-D interconnects is proposed to compute the equivalent surface impedance in this letter. Differing from the traditional algorithm to discretize the conductor cross section, the proposed method only discretizes the contour of the conductor cross section, thus reducing the CPU time and memory cost. The loss characteristics of conductors describing the skin effect are taken into account through Green's function. The equivalent surface impedance model can be used to simplify electromagnetic simulation only using electric field integral equation. Numerical results show that the proposed method is both efficient and accurate in a broadband frequency, which is suited for modeling of 3-D interconnects and integrated passive structures.
ISSN:1531-1309
1558-1764
DOI:10.1109/LMWC.2016.2630842