Influence of Coil Size and Operating Temperature on the Transient Stability of a Multi-Stacked No-Insulation REBCO Pancake Coil System

The no-insulation (NI) coil is a technology expected to realize both high current density and high thermal stability which are essentially trade-off relationship in REBCO coil application. This technique has been studied mainly for application to small-diameter inner coils of NMR magnets exceeding 3...

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Bibliographic Details
Published inIEEE transactions on applied superconductivity Vol. 30; no. 4; pp. 1 - 5
Main Authors Onoshita, Haruka, Yoshihara, Yuka, Ueda, Hiroshi, Noguchi, So, Ishiyama, Atsushi
Format Journal Article
LanguageEnglish
Published New York IEEE 01.06.2020
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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Summary:The no-insulation (NI) coil is a technology expected to realize both high current density and high thermal stability which are essentially trade-off relationship in REBCO coil application. This technique has been studied mainly for application to small-diameter inner coils of NMR magnets exceeding 30 T. In this case, the coil is cooled using 4.2-K liquid He. We are developing an NI-REBCO coil system for high-magnetic-field whole-body MRI, and for a medical cyclotron to be used for cancer therapy. The NI-REBCO coil which we aim for development has a diameter of ∼1 m, a generated magnetic field is ∼10 T, and a conduction cooling around 30 K is assumed. Because the size, operating temperature, and magnetic field differ from those of NMR coil, it is possible that the electromagnetic, thermal, and mechanical behaviors will be quite different. In this paper, we report on these behaviors when a local deterioration occurs in NI-REBCO double-pancake coils using numerical analysis considering coil size, operating temperature, and magnetic field as parameters. For the numerical simulation, we conducted a coupled analysis of current distribution analysis based on PEEC (Partial Element Equivalent Circuit) model and thermal analysis by the 2-dimensional finite element method.
ISSN:1051-8223
1558-2515
DOI:10.1109/TASC.2020.2974847