Characterization of Transport Current Behavior in the Soldered Joint Area of HTS Tapes Using Magnetization Distribution Measurement

Using 2D mapping of three components of magnetic field data, we successfully obtained transport current profiles at the solder joint area of GdBCO tapes, by solving the inverse problem. Contrary to the expectation that the current will be transferred uniformly over the entire joint, the measurement...

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Bibliographic Details
Published inIEEE transactions on applied superconductivity Vol. 31; no. 5; pp. 1 - 4
Main Authors Chikumoto, Noriko, Yamaguchi, Satarou, Shyshkin, Oleg
Format Journal Article
LanguageEnglish
Published New York IEEE 01.08.2021
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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Summary:Using 2D mapping of three components of magnetic field data, we successfully obtained transport current profiles at the solder joint area of GdBCO tapes, by solving the inverse problem. Contrary to the expectation that the current will be transferred uniformly over the entire joint, the measurement showed the transfer current was concentrated at the downstream side of the joint edge. This observation suggests that it is necessary to carefully check not only the joint resistance but also at the current distribution.
ISSN:1051-8223
1558-2515
DOI:10.1109/TASC.2021.3070126