Mechanism of Mechanical and Chemical Polishing in Low Dielectric Constant Plasma-Enhanced Chemical Vapor Deposition SiOC Layer from Hexamethyldisiloxane

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Bibliographic Details
Published inElectrochemical and solid-state letters Vol. 4; no. 8; p. G65
Main Authors Hara, Tohru, Togoh, Fumiaki, Kurosu, Toshiaki, Sakamoto, Keiichi, Shioya, Yoshimi, Ishimaru, Tomomi, Doy, Toshiro K.
Format Journal Article
LanguageEnglish
Published 01.08.2001
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ISSN:1099-0062
DOI:10.1149/1.1382889