Micro–Nano Dual-Scale Particle-Reinforced TiB2/Cu-0.5Cr Composites Prepared by Vacuum Arc Melting

• Published in: Journal of materials engineering and performance Vol. 29; no. 5; pp. 3353 - 3360
• Main Authors: Feng, Jiang, Liang, Shuhua, Song, Kexing, Guo, Xiuhua, Zhou, Yanjun
• Format: Journal Article
• Language: English
• Published: New York Springer US 01.05.2020
• Subjects: Characterization and Evaluation of Materials; Chemistry and Materials Science; Corrosion and Coatings; Engineering Design; Materials Science; Quality Control; Reliability; Safety and Risk; Tribology; vacuum arc melting; copper matrix composite; Cu-Cr; TiB; dual-scale
• ISSN: 1059-9495; 1544-1024
• DOI: 10.1007/s11665-020-04850-6

In the present study, a TiB 2 particle-reinforced Cu/Cu-0.5Cr composite was prepared by vacuum arc melting (VAM). The microstructure, mechanical properties and electrical conductivity of the composite after heat treatment were studied. The results show that the micro–nano dual-scale particle-reinforced TiB 2 /Cu-0.5Cr (VAM) composite possessed high strength, high hardness and high electrical conductivity. The nano-Cr particles were uniformly dispersed in the copper matrix, and the particle size was below 20 nm. The TiB 2 particles were also uniformly dispersed and had good bonding with the copper matrix. After peak aging at 475 °C for 4 h, the comprehensive properties of the TiB 2 /Cu-0.5Cr (VAM) composite were improved. The hardness and electrical conductivity were 99.6 HBW and 82.3% IACS, respectively. The tensile test results show that the tensile strength of the TiB 2 /Cu-0.5Cr (VAM) composite was 401 MPa, which is higher than that of the TiB 2 /Cu (VAM) composite. The TiB 2 /Cu-0.5Cr (VAM) composite had high strength and hardness due to the strengthening of the micro–nano dual-scale particles and the good interface bonding. Based on the tensile fracture morphology of the composite, the failure mechanism of the composite was determined and is discussed.