Ultrathin flexible poly(vinylidene fluoride)/MXene/silver nanowire film with outstanding specific EMI shielding and high heat dissipation

• Published in: Advanced composites and hybrid materials Vol. 4; no. 3; pp. 505 - 513
• Main Authors: Cheng, Haoran, Pan, Yamin, Chen, Qiang, Che, Renchao, Zheng, Guoqiang, Liu, Chuntai, Shen, Changyu, Liu, Xianhu
• Format: Journal Article
• Language: English
• Published: Cham Springer International Publishing 01.09.2021
• Subjects: Ceramics; Chemistry and Materials Science; Composites; Glass; Materials Engineering; Materials Science; Natural Materials; Original Research; Polymer Sciences; Electromagnetic interference shielding; Synergism; Polymer-matrix composites (PMCs); Electric conductivity
• ISSN: 2522-0128; 2522-0136
• DOI: 10.1007/s42114-021-00224-1

Herein, ultrathin flexible poly(vinylidene fluoride) (PVDF) composite films with MXenes and silver nanowires (AgNWs) were prepared via solution casting method. Due to the synergistic effects induced by MXene/AgNW network, the electrical conductivity, thermal conductivity, and electromagnetic interference (EMI) shielding of PVDF/MXene/AgNW films were higher than the corresponding PVDF/MXene and PVDF/AgNW films, and the values of PVDF/MXene/AgNW films at 300 μm thickness were reached 1.08 S/m, 0.78 W/(mK), and 25.87 dB, respectively. Additionally, due to the ultrathin thickness, the high specific shielding value of 1091 dB cm 2 /g was achieved. Moreover, the total shielding effectiveness increased from 19.31 to 41.26 dB as the thickness was increased from 150 to 600 μm. The main EMI shielding mechanism is contribution to the absorption. The possible synergistic mechanisms for enhancing EMI shielding and mechanical performance are discussed. This work offers a promising solution for EMI shielding challenges in modern smaller and smaller wearable devices. Graphical abstract Ultrathin flexible PVDF/MXenes/AgNWs films shows 1.08 S/m electrical conductivity, 0.78 W/(mK) thermal conductivity and 1091 dBcm 2 /g specific EMI shielding.