8-Channel 448 Gbit/s silicon photonic transmitter enabled by photonic wire bonding

We demonstrate an eight-channel hybrid multi-chip module comprising InP lasers, silicon photonic modulators, and parallel single-mode fibers, all connected via photonic wire bonds. We transmit 28 GBd PAM-4 signals at a total data rate of 448 Gbit/s over 2 km.

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Bibliographic Details
Published in2017 Optical Fiber Communications Conference and Exhibition (OFC) pp. 1 - 3
Main Authors Billah, M. R., Blaicher, M., Kemal, J. N., Hoose, T., Zwickel, H., Dietrich, P.-I, Troppenz, U., Moehrle, M., Merget, F., Hofmann, A., Witzens, J., Randel, S., Freude, W., Koos, C.
Format Conference Proceeding
LanguageEnglish
Published OSA 01.03.2017
Subjects
Bonding
Europe
Optimized production technology
Photonics
Semiconductor lasers
Silicon
Wires
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Summary:We demonstrate an eight-channel hybrid multi-chip module comprising InP lasers, silicon photonic modulators, and parallel single-mode fibers, all connected via photonic wire bonds. We transmit 28 GBd PAM-4 signals at a total data rate of 448 Gbit/s over 2 km.
DOI:10.1364/OFC.2017.Th5D.6