Optical Fiber-Based Confocal and Interferometric System for Measuring the Depth and Diameter of Through Silicon Vias

To measure the depth and diameter of through silicon vias simultaneously, a novel method based on spectral-domain interferometer and confocal microscope is proposed and realized. Most parts of the measurement system are constructed with optical fiber components for flexible configuration and easy al...

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Bibliographic Details
Published inJournal of lightwave technology Vol. 34; no. 23; pp. 5462 - 5466
Main Authors Ahn, Heulbi, Park, Jungjae, Kim, Jong-Ahn, Jin, Jonghan
Format Journal Article
LanguageEnglish
Published New York IEEE 01.12.2016
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Confocal microscopy
depth measurement
diameter measurement
Interference
Interferometers
Optical fibers
Optical interferometry
Optical reflection
Optical variables measurement
Semiconductor device measurement
Semiconductor devices
Through-silicon vias
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Summary:To measure the depth and diameter of through silicon vias simultaneously, a novel method based on spectral-domain interferometer and confocal microscope is proposed and realized. Most parts of the measurement system are constructed with optical fiber components for flexible configuration and easy alignment. According to the measurement results and performance evaluation, the mean values of the diameter and depth were 6.07 μm and 48.255 μm with the expanded uncertainties of 0.20 μm (k = 2) and 37 nm (k = 2), respectively.
ISSN:0733-8724
1558-2213
DOI:10.1109/JLT.2016.2618419