Hydrothermal–galvanic couple synthesis of directionally oriented BaTiO3 thin films on TiN-coated substrates
BaTiO3 films were synthesized on TiN-coated Si substrate below 100°C by a hydrothermal–galvanic couple technique in barium contained alkaline solutions. X-ray diffraction and electron backscatter diffraction results show that the BaTiO3 thin films were directionally oriented grown on the TiN/Si subs...
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Published in | Thin solid films Vol. 542; pp. 108 - 113 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
Amsterdam
Elsevier B.V
02.09.2013
Elsevier |
Subjects | |
Online Access | Get full text |
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Summary: | BaTiO3 films were synthesized on TiN-coated Si substrate below 100°C by a hydrothermal–galvanic couple technique in barium contained alkaline solutions. X-ray diffraction and electron backscatter diffraction results show that the BaTiO3 thin films were directionally oriented grown on the TiN/Si substrates, i.e., (111) BaTiO3 over (111) TiN. The surface morphologies revealed that BaTiO3 nucleated and grew over the TiN surface with a single layer. From kinetic analyses, the growth rates of BaTiO3 films prepared by the hydrothermal–galvanic couple technique were faster than a hydrothermal method. The galvanic effects were confirmed by investigating the induced currents and energies. The galvanic currents were generated and controlled by both the dissolution of TiN and the formation of BaTiO3. The output electric energies increased rapidly with the reaction time and leveled off at the full coverage of BaTiO3.
•Cubic BaTiO3 films are synthesized by a hydrothermal–galvanic couple method (HT–GC).•Growth rates of BaTiO3 films made by HT–GC are faster than a hydrothermal method.•BaTiO3 films are directionally oriented grown on the TiN/Si substrates.•Galvanic currents are controlled by dissolution of TiN and formation of BaTiO3. |
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Bibliography: | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
ISSN: | 0040-6090 1879-2731 |
DOI: | 10.1016/j.tsf.2013.06.060 |