Interconnection and lamination technologies towards ubiquitous integration of photovoltaics

• Published in: Progress in photovoltaics Vol. 31; no. 11; pp. 1114 - 1129
• Main Authors: Govaerts, Jonathan, Borgers, Tom, Luo, Bin, Van Dyck, Rik, van der Heide, Arvid, Reekmans, Bart, Vastmans, Luc, Moors, Reinoud, Doumen, Geert, Tous, Loic, Poortmans, Jef
• Format: Journal Article
• Language: English
• Published: Bognor Regis Wiley Subscription Services, Inc 01.11.2023
• Subjects: Aesthetics; Automotive glass; Encapsulation; Photovoltaic cells; Reliability; Sun roofs; Thermal cycling; Weight reduction; Wire
• ISSN: 1062-7995; 1099-159X
• DOI: 10.1002/pip.3730

Abstract In this paper, we first give some historical background and trends in PV module technologies with a focus on the growing trend towards ‘PV everywhere’, mainly targeting improved aesthetics, dimensional freedom including curved surfaces, weight concerns and specific reliability testing. This section acts as an introductory review of the field. Then, in the following sections, we elaborate on two technological developments in this field where we are active: (i) multi‐wire interconnection and (ii) advanced encapsulation. In terms of multi‐wire interconnection, this technology offers improved aesthetics, a similar performance and dimensional freedom compared to the traditional tabbing‐stringing process, and the experiments show promising results on extended reliability testing, including thermal cycling, damp heat and humidity freeze, as well as high‐temperature storage. In terms of advanced encapsulation, we introduce our approach for curved surfaces using a double‐membrane laminator and present results on fabricating curved modules, targeting as demonstration examples on the one hand, glass–glass sunroofs, and on the other hand, lighter‐weight bonnets for automotive applications. We mix examples targeting building and automotive applications, to illustrate the variety of requirements (colours, curvature, weight, reliability, safety), although this variety within building and vehicle applications is probably as large as between them.