Electrodeposition of bismuth, tellurium, and bismuth telluride thin films from choline chloride–oxalic acid ionic liquid

This article presents a series of preliminary results regarding the electrodeposition of bismuth, tellurium, and bismuth telluride films at 60 °C from ionic liquids, containing a mixture of choline chloride and oxalic acid (ChCl–OxA). Ten millimolar concentration solutions of BiCl 3 and TeO 2 were u...

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Bibliographic Details
Published inJournal of applied electrochemistry Vol. 43; no. 3; pp. 309 - 321
Main Authors Agapescu, Camelia, Cojocaru, Anca, Cotarta, Adina, Visan, Teodor
Format Journal Article
LanguageEnglish
Published Dordrecht Springer Netherlands 01.03.2013
Subjects
Chemistry
Chemistry and Materials Science
Electrochemistry
Industrial Chemistry/Chemical Engineering
Original Paper
Physical Chemistry
Electrochemical deposition
Thin films
Bismuth
Bismuth telluride
Tellurium
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Summary:This article presents a series of preliminary results regarding the electrodeposition of bismuth, tellurium, and bismuth telluride films at 60 °C from ionic liquids, containing a mixture of choline chloride and oxalic acid (ChCl–OxA). Ten millimolar concentration solutions of BiCl 3 and TeO 2 were used as precursors in this supporting electrolyte. Cyclic voltammetry and electrochemical impedance spectroscopy techniques were used to demonstrate the deposition processes on Pt and Cu electrodes. Long-time electrolyses (30–120 min) performed at 60 °C with potential control (between −0.22 and −0.37 V vs. Ag reference electrode) have resulted in films deposited on copper substrate. Film surfaces were studied by scanning electron microscopy and analyzed by energy dispersive X-ray spectroscopy. The results of this study show that ChCl–OxA ionic liquid may be considered as a promising substitute of aqueous baths for Bi, Te or Bi 2 Te 3 film plating.
ISSN:0021-891X
1572-8838
DOI:10.1007/s10800-012-0487-0