Nanocrystalline Nickel Deposition on the Titanium Alloys Using High Solution Flow Velocity

• Published in: Journal of materials engineering and performance Vol. 22; no. 3; pp. 706 - 712
• Main Authors: Vakilipour Takaloo, Ashkan, Hussain, Mohammad Sakhawat, Atabaki, Mehdi Mazar, Vakilipour Takaloo, Shayan, Joo, Seung Ki
• Format: Journal Article
• Language: English
• Published: Boston Springer US 01.03.2013
• Subjects: Characterization and Evaluation of Materials; Chemistry and Materials Science; Corrosion and Coatings; Engineering Design; Materials Science; Quality Control; Reliability; Safety and Risk; Tribology; high-speed deposition; nickel; electroplating; titanium
• ISSN: 1059-9495; 1544-1024
• DOI: 10.1007/s11665-012-0298-9

An innovative process has been developed for electroplating of nickel on titanium surface using fast solution flow technique. Nickel was directly deposited on a titanium alloy without using any pre-treatment process. Level of adhesion was determined using quantitative peel test and characterization of the deposition was performed by scanning electron microscopy. Results showed that the rate of nickel deposition at 60 °C was higher than that of the rate of nickel deposition at 40 °C. Moreover, Watts solution provided higher rate of nickel deposition compared to the sulfate-based nickel solution. The rate of deposition increased with increasing the solution flow velocity from 1.5 to 3 m/s and raising current density from 0.4 × 10 4 to 1.6 × 10 4  A/m 2 for both solution baths. Adhesion test indicated good level of adhesion between the deposited nickel and titanium surface. The bonding toughness increased to 4 J/m 2 for 1.2 × 10 4  A/m 2 as a result of higher deposition rate. However, the mechanism responsible for the coating process was discussed in detail.