Hybrid integration for silicon photonics applications

In this paper we show how III-V semiconductors can benefit from advanced silicon fabrication processes and comply with their environment in particular to achieve electrically pumped III-V on silicon lasers for both intra-chip and off-chip applications.

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Bibliographic Details
Published inOptical and quantum electronics Vol. 44; no. 12-13; pp. 527 - 534
Main Authors Grenouillet, L., Dupont, T., Philippe, P., Harduin, J., Olivier, N., Bordel, D., Augendre, E., Gilbert, K., Grosse, P., Chelnokov, A., Fedeli, J. M.
Format Journal Article
LanguageEnglish
Published Boston Springer US 01.10.2012
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Summary:In this paper we show how III-V semiconductors can benefit from advanced silicon fabrication processes and comply with their environment in particular to achieve electrically pumped III-V on silicon lasers for both intra-chip and off-chip applications.
ISSN:0306-8919
1572-817X
DOI:10.1007/s11082-012-9574-z