The effect of nickel presence in anodic copper on kinetics and mechanism of anodic dissolution and cathodic deposition of copper

The influence of the presence of Ni atoms, as foreign metal atoms in anode copper, on kinetics, as foreign metal atoms in anode copper, and on the mechanism of anodic dissolution and cathodic deposition of copper in acidic sulfate system has been investigated. The galvanostatic single-pulse method h...

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Bibliographic Details
Published inJournal of the Electrochemical Society Vol. 148; no. 6; pp. C443 - C446
Main Authors STANKOVIC, Z. D, CVETKOVSKI, V, RAJCIC-VUJASINOVIC, M
Format Journal Article
LanguageEnglish
Published Pennington, NJ Electrochemical Society 01.06.2001
Subjects
Chemistry
Electrochemistry
Electrodes: preparations and properties
Exact sciences and technology
General and physical chemistry
Other electrodes
Transition metal
Copper II Sulfates
Experimental study
Acidic solution
Sulfuric acid
Electrodes
Copper Alloys
Corrosion
Anodic dissolution
Electrodeposition
Copper
Nickel Alloys
Electrochemical reaction
Binary alloy
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Summary:The influence of the presence of Ni atoms, as foreign metal atoms in anode copper, on kinetics, as foreign metal atoms in anode copper, and on the mechanism of anodic dissolution and cathodic deposition of copper in acidic sulfate system has been investigated. The galvanostatic single-pulse method has been used. Results indicate that presence of Ni atoms in anode copper, decreases the exchange current density as determined from the Tafel analysis of the electrode reaction. It is connected with the decrease of the crystal lattice parameter determined from XRD analysis of the electrode material.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0013-4651
1945-7111
DOI:10.1149/1.1372214