Diffusion of iron in silicon dioxide

A quantitative analysis of diffusion of iron in silicon dioxide is presented. A source of iron deposited on the surface of thermally oxidized silicon wafers was diffused at temperatures ranging from 700-1100 deg C in an inert (nitrogen) ambient. The iron concentration in SiO sub 2 and Si was measure...

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Bibliographic Details
Published inJournal of the Electrochemical Society Vol. 146; no. 10; pp. 3773 - 3777
Main Authors RAMAPPA, D. A, HENLEY, W. B
Format Journal Article
LanguageEnglish
Published Pennington, NJ Electrochemical Society 01.10.1999
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Summary:A quantitative analysis of diffusion of iron in silicon dioxide is presented. A source of iron deposited on the surface of thermally oxidized silicon wafers was diffused at temperatures ranging from 700-1100 deg C in an inert (nitrogen) ambient. The iron concentration in SiO sub 2 and Si was measured using total reflection X-ray fluorescence, deep level transient spectroscopy, and surface photo-voltage techniques. A two-boundary diffusion model was applied to the experimental data to determine the diffusivity and segregation coefficient of iron in SiO sub 2 . It is observed that iron diffusivity in SiO sub 2 follows the Arrhenius relationship and has a thermal activation energy of 1.51 eV. Iron exhibits a strong tendency to segregate into silicon dioxide and has a value of k = 1.1 x 10 exp -7 at 1000 deg C, where k = N sub Si /N sub oxide .
Bibliography:ObjectType-Article-2
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content type line 23
ISSN:0013-4651
1945-7111
DOI:10.1149/1.1392548