Poplar wood treated with nano-silver–copper particles: fungal degradation and leaching analysis

• Published in: Holzforschung Vol. 78; no. 5; pp. 293 - 302
• Main Authors: Wang, Xiwei, Yi, Tengfei, Luo, Hongxue, Qi, Yanran, Yao, Fengbiao, Liu, Yiliang, Li, Yongfeng
• Format: Journal Article
• Language: English
• Published: De Gruyter 27.05.2024
• Subjects: decay resistance; leaching rate; nano-silver–copper; wood
• ISSN: 0018-3830; 1437-434X
• DOI: 10.1515/hf-2023-0128

This study investigated the inhibition effect of nanoscale silver–copper particle (20 nm) against and . Poplar wood samples ( L.) were vacuum-impregnated using aqueous nano-AgCu solutions at concentrations of 0.01 %, 0.02 %, 0.03 %, 0.05 %, 0.075 %, and 0.1 %. Alkaline copper quaternary (ACQ, 0.1 %), boric acid (0.2 %) and untreated control group (CK) were employed for comparisons. Decay resistance and leachability were studied. The anti-fungi effects were compared between nano-AgCu, nano-Ag, Ag (silver nitrate), Cu (copper nitrate), and a composite of Ag –Cu . Nano-AgCu particle exhibited effective resistance to fungi after 12 weeks of exposure. The threshold retention of the nano-AgCu against and on poplar wood was 0.19 kg m and 0.62 kg m , respectively. The silver–copper nanoparticles demonstrated excellent leach resistance, and the inhibition effect was retained after leaching. The nano-AgCu particle provided better antifungal effects than single ions or metal nanoparticles. This study illustrates the potential of using nano-AgCu particle as an efficient wood preservative compared to commercial water-soluble preservatives.