Effects of Additives on the Deposition Rate of Autocatalytic Electroless Tin Plating

Effects of additives on the deposition rate of autocatalytic tin plating were studied for the bath using TiCl3 as a reducing agent. The deposition rate was greatly increased by adding either Ca or Mg to the bath, while drastically decreased by Tl or Sb. Other additives examined, i.e. Zn, Ni, Sr, Mn,...

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Bibliographic Details
Published inHyōmen gijutsu Vol. 46; no. 7; pp. 667 - 669
Main Authors SENDA, Atsuo, KANBAYASHI, Yoshihiro, TAKANO, Yoshihiko, MORITA, Kazuhiro
Format Journal Article
LanguageEnglish
Japanese
Published Tokyo The Surface Finishing Society of Japan 01.07.1995
Hyomen Gijutsu Kyokai
Japan Science and Technology Agency
Subjects
Additive Effect
Deposition Rate
Electroless Tin Plating
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Summary:Effects of additives on the deposition rate of autocatalytic tin plating were studied for the bath using TiCl3 as a reducing agent. The deposition rate was greatly increased by adding either Ca or Mg to the bath, while drastically decreased by Tl or Sb. Other additives examined, i.e. Zn, Ni, Sr, Mn, Ba, Fe, Al and Sn had no effects on the rate. It was also found desirable to add Ca and Mg as chlorides, iodides, bromides, sulfates, acetates and phosphinates for increasing the deposition rate, whereas not desirable, as nitrates.
ISSN:0915-1869
1884-3409
DOI:10.4139/sfj.46.667