High temperature CoSb3–Cu junctions

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Published in	Microelectronics and reliability Vol. 51; no. 7; pp. 1198 - 1202
Main Authors	Wojciechowski, Krzysztof Tomasz, Zybala, Rafal, Mania, Ryszard
Format	Journal Article Conference Proceeding
Language	English
Published	Kidlington Elsevier 01.07.2011
Subjects	Cross-disciplinary physics: materials science; rheology Deposition by sputtering Exact sciences and technology Materials science Methods of deposition of films and coatings; film growth and epitaxy Physics Microprobe Fillers Polycrystals High temperature Thermoelectric effect Thermoelectric materials Scanning tunneling microscopy Cathode sputtering Scanning microscope Energy dispersion Diffusion barriers Chemical composition Copper Microstructure IV characteristic Electrical characteristic
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Author	Zybala, Rafal Wojciechowski, Krzysztof Tomasz Mania, Ryszard
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Keywords	Microprobe Fillers Polycrystals High temperature Thermoelectric effect Thermoelectric materials Scanning tunneling microscopy Cathode sputtering Scanning microscope Energy dispersion Diffusion barriers Chemical composition Copper Microstructure IV characteristic Electrical characteristic
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References	10.1016/j.microrel.2011.03.033_b0085 Wojciechowski (10.1016/j.microrel.2011.03.033_b0065) 2008; 82 10.1016/j.microrel.2011.03.033_b0040 Zhao (10.1016/j.microrel.2011.03.033_b0050) 2009; 17 Wojciechowski (10.1016/j.microrel.2011.03.033_b0015) 2010; 39 Sales (10.1016/j.microrel.2011.03.033_b0020) 1996; 272 Fan (10.1016/j.microrel.2011.03.033_b0045) 2004; 58 Lamberton (10.1016/j.microrel.2011.03.033_b0025) 2002; 80 Luo (10.1016/j.microrel.2011.03.033_b0075) 1996; 31 Bandhari (10.1016/j.microrel.2011.03.033_b0005) 1995 El-Genk (10.1016/j.microrel.2011.03.033_b0030) 2003; 44 Zhao (10.1016/j.microrel.2011.03.033_b0055) 2009; 477 El-Genk (10.1016/j.microrel.2011.03.033_b0080) 2003; 44 Wojciechowski (10.1016/j.microrel.2011.03.033_b0070) 2009; 37 Rowe (10.1016/j.microrel.2011.03.033_b0010) 2006; 1 Zhongwei (10.1016/j.microrel.2011.03.033_b0060) 2009; 610–613
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Title	High temperature CoSb3–Cu junctions
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