High temperature CoSb3–Cu junctions

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Bibliographic Details
Published inMicroelectronics and reliability Vol. 51; no. 7; pp. 1198 - 1202
Main Authors Wojciechowski, Krzysztof Tomasz, Zybala, Rafal, Mania, Ryszard
Format Journal Article Conference Proceeding
LanguageEnglish
Published Kidlington Elsevier 01.07.2011
Subjects
Cross-disciplinary physics: materials science; rheology
Deposition by sputtering
Exact sciences and technology
Materials science
Methods of deposition of films and coatings; film growth and epitaxy
Physics
Microprobe
Fillers
Polycrystals
High temperature
Thermoelectric effect
Thermoelectric materials
Scanning tunneling microscopy
Cathode sputtering
Scanning microscope
Energy dispersion
Diffusion barriers
Chemical composition
Copper
Microstructure
IV characteristic
Electrical characteristic
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ISSN:0026-2714
DOI:10.1016/j.microrel.2011.03.033