APA (7th ed.) Citation

Tabata, T., Sanchez, L., Fournel, F., & Moriceau, H. (2015). Reliable four-point flexion test and model for die-to-wafer direct bonding. Journal of applied physics, 118(1), . https://doi.org/10.1063/1.4923357

Chicago Style (17th ed.) Citation

Tabata, T., L. Sanchez, F. Fournel, and H. Moriceau. "Reliable Four-point Flexion Test and Model for Die-to-wafer Direct Bonding." Journal of Applied Physics 118, no. 1 (2015). https://doi.org/10.1063/1.4923357.

MLA (9th ed.) Citation

Tabata, T., et al. "Reliable Four-point Flexion Test and Model for Die-to-wafer Direct Bonding." Journal of Applied Physics, vol. 118, no. 1, 2015, https://doi.org/10.1063/1.4923357.