On the origin of the dielectric breakdown mechanism in plasma-polymerized hexamethyldisiloxane films

Dielectric breakdown phenomena of plasma-deposited hexamethyldisiloxane are discussed. We show that the deposition conditions and post-treatment can change the dielectric strength. A lowering of the breakdown field was attributed to reactions with oxygen species during or after deposition.

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Bibliographic Details
Published inThin solid films Vol. 170; no. 2; pp. 235 - 240
Main Authors Montalan, D., Souag, N., Segui, Y., Laurent, C.
Format Journal Article
LanguageEnglish
Published Lausanne Elsevier B.V 15.03.1989
Elsevier Science
Subjects
Applied sciences
Exact sciences and technology
Physicochemistry of polymers
Polymerization
Polymers and radiations
Dimethylsiloxane polymer
Dielectric strength
Property processing relationship
Dielectric properties
Plasma deposition
Glow discharge polymerization
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Summary:Dielectric breakdown phenomena of plasma-deposited hexamethyldisiloxane are discussed. We show that the deposition conditions and post-treatment can change the dielectric strength. A lowering of the breakdown field was attributed to reactions with oxygen species during or after deposition.
ISSN:0040-6090
1879-2731
DOI:10.1016/0040-6090(89)90729-3