A method for the determination of the thermally induced optical and structural changes of polymers used to fabricate lightpipes integrated in CMOS image sensor arrays

In this article, we will present a method to be able to determine the thermally induced optical and structural changes of polymers used to realize lightpipes integrated in CMOS image sensor pixel arrays. The reduction of the pixel size to the visible wavelength scale increases the diffraction of the...

Full description

Saved in:
Bibliographic Details
Published inSensors and actuators. A. Physical. Vol. 167; no. 2; pp. 385 - 388
Main Authors Marinelli, Rino, Palange, Elia, Faccio, Marco, Guerrieri, Stefano, Del Monte, Andrea, De Amicis, Giovanni, D’Anna, Alfonso
Format Journal Article
LanguageEnglish
Published Elsevier B.V 01.06.2011
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:In this article, we will present a method to be able to determine the thermally induced optical and structural changes of polymers used to realize lightpipes integrated in CMOS image sensor pixel arrays. The reduction of the pixel size to the visible wavelength scale increases the diffraction of the transmitted light, and lightpipes can compensate this effect by improving light confinement in each pixel enhancing the resulting device external quantum efficiency. Thus, the measurements of the polymer structural and optical changes are the key parameters for the optimization of the guiding and transmission properties of the lightpipe. Spectroscopic ellipsometric measurements allow users to determine the variations of the polymer film refractive index and thickness as a function of the thermal budgets for temperatures ranging from 250 °C to 500 °C. On the other hand, thermogravimetric analysis permits users to relate the variations of these parameters to the polymer structural modifications as a function of the increasing temperature.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0924-4247
1873-3069
DOI:10.1016/j.sna.2011.03.009