Effect of Phosphorus Codeposition on Properties of Palladium-Phosphorus Alloys Deposited from Electroless Plating Baths Using Hypophosphite as a Reducing Agent

The effects of phosphorus codeposition on internal stress and occluded hydrogen in electroless plated palladium-phosphorus alloy films were investigated. Phosphorus contents in alloy films were proportional to the 0.2 power of sodium hypophosphite concentration. Tensile stress and occluded hydrogen...

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Bibliographic Details
Published inHyōmen gijutsu Vol. 47; no. 12; pp. 1060 - 1064
Main Authors NAWAFUNE, Hidemi, MIZUMOTO, Shozo, HAGA, Masaki, UCHIDA, Ei
Format Journal Article
LanguageEnglish
Japanese
Published Tokyo The Surface Finishing Society of Japan 01.12.1996
Hyomen Gijutsu Kyokai
Japan Science and Technology Agency
Subjects
Electroless Plating
Internal Stress
Occluded Hydrogen
Pd-P Alloy
Phosphorus Codeposition
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Summary:The effects of phosphorus codeposition on internal stress and occluded hydrogen in electroless plated palladium-phosphorus alloy films were investigated. Phosphorus contents in alloy films were proportional to the 0.2 power of sodium hypophosphite concentration. Tensile stress and occluded hydrogen decreased with an increase in the phosphorus content in alloy films. The decrease of tensile stress in alloy films with phosphorus codeposition was found to inhibit the matching of the palladium crystal with phosphorus.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0915-1869
1884-3409
DOI:10.4139/sfj.47.1060