Analysis of the dV/dt effect on an IGBT gate circuit in IPM

The effect ofdV/dt on the IGBT gate circuit in IPM is analyzed both by simulation and experiment. It is shown that a voltage slope applied across the collector-emitter terminals of the IGBT can induce a gate voltage spike through the feedback action of the parasitic capacitances of the IGBT. The dV/...

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Bibliographic Details
Published inJournal of semiconductors Vol. 34; no. 4; pp. 64 - 68
Main Author 华庆 李泽宏 张波 黄祥钧 程德凯
Format Journal Article
LanguageEnglish
Published 01.04.2013
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ISSN1674-4926
DOI10.1088/1674-4926/34/4/045001

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Summary:The effect ofdV/dt on the IGBT gate circuit in IPM is analyzed both by simulation and experiment. It is shown that a voltage slope applied across the collector-emitter terminals of the IGBT can induce a gate voltage spike through the feedback action of the parasitic capacitances of the IGBT. The dV/dt rate, gate-collector capacitance, gate-emitter capacitance and gate resistance have a direct influence on this voltage spike. The device with a higher dV/dt rate, gate-collector capacitance, gate resistance and lower gate-emitter capacitance is more prone to dV/dt induced self turn-on. By optimizing these parameters, the dV/dt induced voltage spike can be effectively controlled.
Bibliography:The effect ofdV/dt on the IGBT gate circuit in IPM is analyzed both by simulation and experiment. It is shown that a voltage slope applied across the collector-emitter terminals of the IGBT can induce a gate voltage spike through the feedback action of the parasitic capacitances of the IGBT. The dV/dt rate, gate-collector capacitance, gate-emitter capacitance and gate resistance have a direct influence on this voltage spike. The device with a higher dV/dt rate, gate-collector capacitance, gate resistance and lower gate-emitter capacitance is more prone to dV/dt induced self turn-on. By optimizing these parameters, the dV/dt induced voltage spike can be effectively controlled.
11-5781/TN
IGBT; dV/dt; voltage spike; IPM
Hua Qing, Li Zehong, Zhang Bo, Huang Xiangjun, and Cheng Dekai( 1 State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China 2Midea Air-Conditioning & Refrigeration Research Institute, Foshan 528311, China)
ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
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ISSN:1674-4926
DOI:10.1088/1674-4926/34/4/045001