Investigation of using CNT and Cu/CNT Wires for Replacing Cu for Power Electronics and Electrical Applications
The demand for power electronics increases continuously with the technological development. The next-generation power electronic converter circuits and electrical power system demands for sustainable, highly efficient and higher functionality material which should outperform Cu. In future electrical...
Saved in:
Published in | ECS journal of solid state science and technology Vol. 11; no. 2; pp. 23011 - 23021 |
---|---|
Main Authors | , , |
Format | Journal Article |
Language | English |
Published |
IOP Publishing
01.02.2022
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The demand for power electronics increases continuously with the technological development. The next-generation power electronic converter circuits and electrical power system demands for sustainable, highly efficient and higher functionality material which should outperform Cu. In future electrical systems, Cu transmission cables and windings would be replaced by Carbon Nanotubes (CNTs) and Cu/CNT composite. This paper presents the investigation of using CNT and Cu/CNT wires for replacing Cu for power electronics and electrical applications. Conducting wire made of Cu, Cu/CNT composite and CNT are considered. Frequency domain electromagnetic analysis is carried out to obtain the performance parameters such as magnetic flux density, current density, impedance, voltage, power, resistance losses, inductance and AC resistance at the current of 1 A supplied with the frequency of 50 Hz. Finite Element Modelling (FEM) simulation is carried out using COMSOL Multiphysics. The frequency of the supply current is also varied from 50 Hz to 5 MHz. The analysis shows that Cu/CNT is performing close to Cu in terms of electromagnetic parameters. Thermal analysis is also carried out by varying the current from 1 A to 35 A. CNT conductors produces lowest temperature and perform better in terms of electro-thermal parameters. |
---|---|
Bibliography: | JSS-101886.R2 |
ISSN: | 2162-8769 2162-8777 |
DOI: | 10.1149/2162-8777/ac5471 |