Evaporation cooling of high power electronic devices

This paper presents the problems of choosing heat transfer devices with good heat dissipating ability under boiling, as well as their utilization for cooling power semiconductor devices, for example, diodes, transistors, and thyristors. The experimental investigation of heat transfer crisis in cooli...

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Published inIEEE transactions on components, packaging, and manufacturing technology. Part A Vol. 19; no. 3; pp. 431 - 434
Main Authors Dulnev, G.N., Korablyev, V.A., Sharkov, A.V.
Format Journal Article
LanguageEnglish
Published IEEE 01.09.1996
Subjects
Coolants
Dielectrics
Electronic equipment
Electronics cooling
Heat transfer
Power electronics
Power semiconductor devices
Semiconductor diodes
Temperature dependence
Thyristors
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Summary:This paper presents the problems of choosing heat transfer devices with good heat dissipating ability under boiling, as well as their utilization for cooling power semiconductor devices, for example, diodes, transistors, and thyristors. The experimental investigation of heat transfer crisis in cooling channels under the forced movement of dielectric coolant was carried out.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:1070-9886
1558-3678
DOI:10.1109/95.536845