Deep Wet Etching Uniformity of Polished Fused Silica Glass

• Published in: Key Engineering Materials Vol. 726; pp. 404 - 408
• Main Authors: Song, Xue Fu, Wang, Hui, Sun, Yuan Cheng, Du, Xiu Rong, Yang, Xiao Hui, Zhang, Xiao Qiang
• Format: Journal Article
• Language: English
• Published: Trans Tech Publications Ltd 2017
• Subjects: Etching; Fused silica; Glass; Polished; Quartz; Reeds; Variability; Fused Silica Glass; Uniformity of Etching Depth; Wet Etching; HF Solution
• ISBN: 3038357871; 9783038357872
• ISSN: 1013-9826; 1662-9795; 1662-9795
• DOI: 10.4028/www.scientific.net/KEM.726.404

Deep wet etching for polished fused silica glass in HF solutions was investigated to manufacture quartz pendulous reed with better surface quality and higher size precision. It is widely believed that etching rate was mostly decided by the temperature and concentration of HF solutions. But, in the beginning it was found difficult to control the uniformity of etching depth when the glass was etched for 0.3 ~ 0.5 mm each side. Now, it is detected with help from new designed etching machine that depth of 0.5mm or more can be achieved very easily. And the uniformity about ±0.002 mm would also be realized easily by keeping the sample glass at same depth and moving all the time in HF solution with the temperature and concentration are 45°C and 40% HF