Early package analysis: considerations and case study

Several issues associated with multichip module (MCM) system design are discussed. An early analysis tool for evaluating the tradeoffs between a design and packaging technology is presented. A case study of a possible design point suggested by combining different package elements being used in MCMs...

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Bibliographic Details
Published inComputer (Long Beach, Calif.) Vol. 26; no. 4; pp. 30 - 39
Main Authors LaPotin, D.P., Mazzawy, T.R., White, M.L.
Format Journal Article
LanguageEnglish
Published IEEE 01.04.1993
Subjects
Ceramics
Computer aided software engineering
Electronics packaging
Manufacturing
Semiconductor device packaging
Silicon
Substrates
System analysis and design
Transistors
Wiring
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Summary:Several issues associated with multichip module (MCM) system design are discussed. An early analysis tool for evaluating the tradeoffs between a design and packaging technology is presented. A case study of a possible design point suggested by combining different package elements being used in MCMs settings is included. The case study indicates that the most effective packaging solution for high-performance applications, requiring multichip modules, will likely represent a progression from cofired ceramics (MCM-C) to a thin-film and hybrid cofired ceramic (MCM-D/C) module.< >
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0018-9162
1558-0814
DOI:10.1109/2.206511