TiN Metal Hard Mask Removal with Selectivity to Tungsten and TiN Liner
Low-pH titanium nitride (TiN) removal formulations utilizing oxidizers other than hydrogen peroxide (H2O2) have been developed with superior TiN selectivity toward W and the inter-level dielectric (ILD) films. One critical challenge is protecting the TiN barrier layer between the W and dielectric la...
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Published in | ECS transactions Vol. 58; no. 6; pp. 261 - 266 |
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Main Authors | , , , , , , |
Format | Journal Article |
Language | English |
Published |
The Electrochemical Society, Inc
31.08.2013
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Online Access | Get full text |
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Summary: | Low-pH titanium nitride (TiN) removal formulations utilizing oxidizers other than hydrogen peroxide (H2O2) have been developed with superior TiN selectivity toward W and the inter-level dielectric (ILD) films. One critical challenge is protecting the TiN barrier layer between the W and dielectric layer, which is often exposed during the TiN metal hard mask (MHM) removal step. This study focused on developing and optimizing formulations with TiN MHM etch rates ≥ 100 Å/min at temperatures ≤ 60oC, with compatibility toward W, ILD films, and the TiN liner. The galvanic corrosion was tailored to protect the TiN liner in the presence of W. A simple yet novel patterned wafer test vehicle was developed to facilitate this work, enabling the investigation of the chemical impact at the W/TiN liner interface. |
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ISSN: | 1938-5862 1938-6737 |
DOI: | 10.1149/05806.0261ecst |