PCIE IP Validation Process Across Process Corner, Voltage and Temperature Conditions

• Published in: Journal of physics. Conference series Vol. 1969; no. 1; pp. 12026 - 12038
• Main Authors: Karim, N. I. A., Wahab, Aeizaal Azman A., Nazli Alhady, Syed Sahal, Wajdi Othman, Wan Amir Fuad, Husin, Hazmarini
• Format: Journal Article
• Language: English
• Published: Bristol IOP Publishing 01.07.2021
• Subjects: Data transfer (computers); Design optimization; Electric potential; Field programmable gate arrays; Logic design; Training; Voltage
• ISSN: 1742-6588; 1742-6596
• DOI: 10.1088/1742-6596/1969/1/012026

Abstract IP validation has become more challenging for FPGA device as it supports high operating speed. PCIe is an IP used for high-speed data transfer. The link training and Initialization takes place at physical layer to initialize the link width and link data rate. The physical layer is getting more complex when it supports higher speed. The stability of link training is improved by optimizing the soft logic design in application layer. Two protocol tests usually validated in industry are link up testing and link & higher layer testing. Debugging tools supported by Quartus are fully utilized to detect any failure during link training. The characterization of link performance covers process corners, voltage and temperature conditions are hard to analyse. The H0 statement shows a significant difference for passing and failing case. The p-value is greater than 0.05 proved H0 statement is accepted. The difference on passing and failing percentage is insignificantly impacting overall link performance of PCIe. It concludes that the bug is random and not caused by any defects on the silicon layout of FPGA device. Thus, IP validation shows the robustness of the device and able to comply with base specification of PCIe.