International Conference on Electronic and Advanced Materials 2021

• Published in: Journal of physics. Conference series Vol. 2169; no. 1; pp. 11001 - 11004
• Main Authors: Saud, Norainiza, Bakar, Sharifah Shahnaz Syed, Ramli, Mohd Izrul Izwan, Nazeri, Muhammad Firdaus Mohd
• Format: Journal Article
• Language: English
• Published: Bristol IOP Publishing 01.01.2022
• Subjects: Electronic materials; Electronic packaging; Geopolymers; International conferences; Polymer matrix composites; Scientists
• ISSN: 1742-6588; 1742-6596
• DOI: 10.1088/1742-6596/2169/1/011001

The International Conference on Electronic and Advanced Materials (ICEAM) 2021 was held online on the 2 nd November 2021 streaming from Digital Management and Development Centre, Universiti Malaysia Perlis (UniMAP). This conference was organized by the Center of Excellence Geopolymer & Green Technology (CEGeoGTech), UniMAP, with Tin Solder Technology Research Group (TSTRG) MALAYSIA and The Electronics Packaging Research Society (EPRS) as co-organizer. The conference was also sponsored by the Tin Industry (R&D) Board. The conference was held virtually in order to follow the standard operation procedure imposed by the Malaysian government due to the COVID-19 movement control order and travel restriction. The conference serves as the best platform for sharing and exchanging ideas on Advanced Materials topics such as electronic materials, ceramic materials and geopolymer, bio-materials, polymers and rubber, and composites. The conference aimed to provide a platform for scientists, researchers, and students in the related field to discuss current research progress, challenges, and practical solutions that could be adopted to keep abreast in this challenging world. The program provides networking and cooperation amongst academicians, scientists, researchers, and engineers from the materials sciences and engineering fields. List of Organizing committee is available in this pdf.