Experimental study on heat transfer characteristics of composite thermosyphon radiator for CPU cooling

Abstract In order to meet the heat dissipation requirements of high-power CPUs and make data center servers more energy-efficient, this paper studies a composite thermosiphon radiator for 400WCPU. The cooling performance of the composite thermosiphon radiator and the degree of optimization compared...

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Bibliographic Details
Published inJournal of physics. Conference series Vol. 2263; no. 1; pp. 12010 - 12017
Main Authors Ba, Cailing, Zhang, Wenkai, Xu, Haipeng, Liu, Yunlong
Format Journal Article
LanguageEnglish
Published Bristol IOP Publishing 01.04.2022
Subjects
Cooling
Data centers
Energy dissipation
Evaporators
Heat
Heat pipes
Heat transfer
Optimization
Physics
Thermal resistance
Thermosyphons
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Summary:Abstract In order to meet the heat dissipation requirements of high-power CPUs and make data center servers more energy-efficient, this paper studies a composite thermosiphon radiator for 400WCPU. The cooling performance of the composite thermosiphon radiator and the degree of optimization compared with the ordinary heat pipes radiator are studied under different heat source power and different air volume conditions. The results show that the thermal resistance of the composite thermosiphon radiator is the lowest at 400W and it has little dependence on the air volume. Compared with the common heat pipe radiator, condenser has been greatly optimized, the evaporator needs to be further optimized. When the CPU power is 200W, the CPU core temperature is optimized by 6°C. It is estimated that when the CPU power is 400W, the CPU core temperature is slightly higher than the temperature spec.
ISSN:1742-6588
1742-6596
DOI:10.1088/1742-6596/2263/1/012010