Effects of vibration on passive intermodulation of microwave connector

Abstract This paper investigates the generation of passive intermodulation (PIM) in coaxial connectors during vibration. A series of experiments were designed and the simulation model and method were proposed for understanding these phenomena. We found that PIM is mainly influenced by the contact st...

Full description

Saved in:
Bibliographic Details
Published inInternational journal of microwave and wireless technologies Vol. 12; no. 1; pp. 39 - 47
Main Authors Li, Tuanjie, Li, Mingtai, Zhai, Wangmin, Jiang, Jie
Format Journal Article
LanguageEnglish
Published Cambridge Cambridge University Press 01.02.2020
Subjects
Acoustics
Antennas
Computer simulation
Connectors
Contact stresses
Experiments
Intermodulation
Microwave communications
Parameter identification
Power spectral density
Surface roughness
Vibration
Vibration effects
Online AccessGet full text

Cover

More Information
Summary:Abstract This paper investigates the generation of passive intermodulation (PIM) in coaxial connectors during vibration. A series of experiments were designed and the simulation model and method were proposed for understanding these phenomena. We found that PIM is mainly influenced by the contact stress and contact surface roughness during vibration. Thus, a power spectral density method is presented to identify the roughness parameter of contact surface based on the Weierstrass–Mandelbrot model, and the simulation model and method were verified by the relative experiments. Eventually, some suggestions for engineering application were provided.
ISSN:1759-0787
1759-0795
DOI:10.1017/S175907871900093X