Electrical characteristics of interconnections for high-performance systems

• Published in: Proceedings of the IEEE Vol. 86; no. 2; pp. 315 - 357
• Main Author: Deutsch, A.
• Format: Journal Article
• Language: English
• Published: New York, NY IEEE 01.02.1998; Institute of Electrical and Electronics Engineers
• Subjects: Applied sciences; Cable shielding; Coupling circuits; Distributed parameter circuits; Electric variables; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics; Electronics; Exact sciences and technology; Frequency; Integrated circuit interconnections; Printed circuits; Propagation losses; Transmission line theory; Wiring; Multichip module; RC circuit; Crosstalk; Coupled line; Skin effect; Transmission line; Interconnection; Electronic packaging; Thick film circuit; Integrated circuit; RLC circuit; Printed circuit; Thin film circuit
• ISSN: 0018-9219; 1558-2256
• DOI: 10.1109/5.659489

A review is presented of the electrical characteristics of high-density, high-performance interconnections used in digital and communication applications. These interconnections behave as lossy transmission lines for the frequency range of interest. A brief theoretical explanation of the key properties of lossy, coupled transmission lines is given. A new short-pulse propagation technique used for characterizing a large category of wiring is described. A detailed description is made of each of the major interconnect types encountered namely, shielded cables, printed circuit boards, ceramic carriers, thin-film wiring, and on-chip wiring. Representative examples are given in each case to highlight the key performance-limiting parameters. The modeling and measurement techniques used are explained and examples are given. Future technological directions and their effect on performance are discussed.