Pulse-thermal processing for electronic applications

The unique high-density plasma arc lamp rapid-thermal processing (RTP) capability at ORNL allows controlled manipulation of materials on the atomistic scale. This unique large-area (currently up to ~1,000 cm^sup 2^) RTP capability is able to apply controlled heat fluxes (up to 20,000 W/cm^sub 2^) to...

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Bibliographic Details
Published inJOM (1989) Vol. 58; no. 6; p. 31
Main Author Ott, Ronald
Format Journal Article
LanguageEnglish
Published New York Springer Nature B.V 01.06.2006
Subjects
Annealing
Electronics
Laboratories
Materials science
Methods
Microstructure
Nanoparticles
Plasma
Temperature
Thin films
United States > US
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Summary:The unique high-density plasma arc lamp rapid-thermal processing (RTP) capability at ORNL allows controlled manipulation of materials on the atomistic scale. This unique large-area (currently up to ~1,000 cm^sup 2^) RTP capability is able to apply controlled heat fluxes (up to 20,000 W/cm^sub 2^) to material surfaces with heating and cooling rates on the order of 104°C/s to 105°C/s in the millisecond time frame.
ISSN:1047-4838
1543-1851
DOI:10.1007/s11837-006-0176-8