Efficient techniques for accurate modeling and simulation of substrate coupling in mixed-signal IC's

• Published in: IEEE transactions on computer-aided design of integrated circuits and systems Vol. 18; no. 5; pp. 597 - 607
• Main Authors: Costa, J.P., Mike Chou, Silveira, L.M.
• Format: Journal Article
• Language: English
• Published: New York, NY IEEE 01.05.1999; Institute of Electrical and Electronics Engineers
• Subjects: Analog-digital conversion; Applied sciences; Boundaries; Boundary element method; Circuit simulation; Circuits; Computer aided design; Computer science; control theory; systems; Coupling circuits; Design automation; Design engineering; Electronics packaging; Exact sciences and technology; Integrated circuit modeling; Integrated circuits; Joining; Laboratories; Mathematical analysis; Medical simulation; Software; Substrates; Tasks; Threshold voltage; Experimental result; Simulation; Network analysis; Integrated circuit; Krylov subspace method; Laplace equation; Algorithm; Green function; Modeling; Computer aided design; Boundary element method; Phase locked loop
• ISSN: 0278-0070; 1937-4151
• DOI: 10.1109/43.759076

Industry trends aimed at integrating higher levels of circuit functionality have triggered a proliferation of mixed analog-digital systems. Magnified noise coupling through the common chip substrate has made the design and verification of such systems an increasingly difficult task. In this paper we present a fast eigendecomposition technique that accelerates operator application in BEM methods and avoids the dense-matrix storage while taking all of the substrate boundary effects into account explicitly. This technique can be used for accurate and efficient modeling of substrate coupling effects in mixed-signal integrated circuits.