FSA SiP Market and Patent Analysis Report

This paper provides an in-depth introduction and analysis on system-in-package (SiP) technology by discussing SiP market perspectives and related SiP patent issues.

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Bibliographic Details
Published inIEEE design & test of computers Vol. 24; no. 2; pp. 184 - 192
Main Author FSA SiP Subcommittee, FSA SiP Subcommittee
Format Journal Article
LanguageEnglish
Published IEEE Computer Society 01.03.2007
Subjects
and manufacturing technology
CMOS process
CMOS technology
Components
Costs
Design engineering
Electronics packaging
Integrated circuit interconnections
Markets
packaging
Packaging machines
patent analysis
Production
Random access memory
Semiconductor device packaging
SiP
SiP market
SoC
system in package
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Summary:This paper provides an in-depth introduction and analysis on system-in-package (SiP) technology by discussing SiP market perspectives and related SiP patent issues.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:0740-7475
1558-1918
DOI:10.1109/MDT.2007.44