Factors Influencing Drying Induced Pattern Collapse

The collapse of high aspect ratio features is a daunting challenge facing the semiconductor industry. The complex physics and dynamics that govern this process are not entirely understood. Through the use of optical video imaging we have observed pattern collapse in real time. It was found that the...

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Bibliographic Details
Published inSolid state phenomena Vol. 282; pp. 201 - 206
Main Authors Mui, David S.L., Kawaguchi, Mark, Musselwhite, Nathan
Format Journal Article
LanguageEnglish
Published Zurich Trans Tech Publications Ltd 01.08.2018
Subjects
Collapse
Drying
High aspect ratio
Meniscus Reconfiguration
Pattern Collapse
Meniscus
Laplace Pressure
Wet Clean
High Aspect-Ratio
Drying Process
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Summary:The collapse of high aspect ratio features is a daunting challenge facing the semiconductor industry. The complex physics and dynamics that govern this process are not entirely understood. Through the use of optical video imaging we have observed pattern collapse in real time. It was found that the liquid meniscus reconfigures itself laterally along the length of the structure as opposed to the expected top-to-bottom drying. Herein, we report on our observations and the physics of drying high aspect ratio structures.
Bibliography:Selected, peer reviewed papers from the 14th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (14th UCPSS 2018), September 3-5, 2018, Leuven, Belgium
ISSN:1012-0394
1662-9779
1662-9779
DOI:10.4028/www.scientific.net/SSP.282.201