New insights on generalized heat conduction and thermoelastic coupling models
With the miniaturization of devices and the development of modern heating technologies, the generalization of heat conduction and thermoelastic coupling has become crucial, effectively emulating the thermodynamic behavior of materials in ultrashort time scales. Theoretically, generalized heat conduc...
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Published in | Applied mathematics and mechanics Vol. 46; no. 8; pp. 1533 - 1550 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
Berlin/Heidelberg
Springer Berlin Heidelberg
01.08.2025
Springer Nature B.V |
Edition | English ed. |
Subjects | |
Online Access | Get full text |
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Summary: | With the miniaturization of devices and the development of modern heating technologies, the generalization of heat conduction and thermoelastic coupling has become crucial, effectively emulating the thermodynamic behavior of materials in ultrashort time scales. Theoretically, generalized heat conductive models are considered in this work. By analogy with mechanical viscoelastic models, this paper further enriches the heat conduction models and gives their one-dimensional physical expression. Numerically, the transient thermoelastic response of the slim strip material under thermal shock is investigated by applying the proposed models. First, the analytical solution in the Laplace domain is obtained by the Laplace transform. Then, the numerical results of the transient responses are obtained by the numerical inverse Laplace transform. Finally, the transient responses of different models are analyzed and compared, and the effects of material parameters are discussed. This work not only opens up new research perspectives on generalized heat conductive and thermoelastic coupling theories, but also is expected to be beneficial for the deeper understanding of the heat wave theory. |
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Bibliography: | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 14 |
ISSN: | 0253-4827 1573-2754 |
DOI: | 10.1007/s10483-025-3280-7 |