Effect of thickness of diamond coatings on the adhesive strength of film-substrate interface

Models of the interface between the diamond film with the thickness from 10 to 60 Å and the cemented carbide substrate are built using the molecular dynamics method, and the interactions of the atoms in the models are represented by coupling Morse potential, Tersoff potential and Lennard-Jones poten...

Full description

Saved in:
Bibliographic Details
Published inMaterials research innovations Vol. 19; no. sup10; pp. S10-190 - S10-193
Main Authors Jian, X. G., Zhang, Y. H., Shi, L. D.
Format Journal Article
LanguageEnglish
Published Taylor & Francis 31.12.2015
Subjects
Adhesive strength
Cemented carbides
Computer programs
Computer simulation
Coupling (molecular)
Diamond film
Diamond films
Interface
Molecular dynamics
Morse potential
Thickness
Online AccessGet full text

Cover

More Information
Summary:Models of the interface between the diamond film with the thickness from 10 to 60 Å and the cemented carbide substrate are built using the molecular dynamics method, and the interactions of the atoms in the models are represented by coupling Morse potential, Tersoff potential and Lennard-Jones potential. The mechanical properties of the models are studied in the form of simulation with the molecular dynamics software Lammps. The simulation results indicate that the adhesive strength of the model with the thickness of the diamond film 20 Å reaches the maximum value of 25.80 GPa, and the adhesive strength declines and keeps stable with the value of 7.0 GPa when the range of the thickness of the diamond film is from 30 to 60 Å.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:1432-8917
1433-075X
DOI:10.1179/1432891715Z.0000000002143