Analysis of the Lifecycles of Automotive Resistor Lead in Random Vibration

• Published in: Journal of electronic testing Vol. 40; no. 1; pp. 101 - 106
• Main Author: Linsen, Huang
• Format: Journal Article
• Language: English
• Published: New York Springer US 01.02.2024; Springer Nature B.V
• Subjects: Accelerated tests; Boundary conditions; CAE) and Design; Circuit boards; Circuits and Systems; Computer-Aided Engineering (CAD; Electrical Engineering; Engineering; Experiments; Failure; Finite element method; Modal analysis; Power spectral density; Printed circuit boards; Printed circuits; Random vibration; Resistors; Simulation; Vibration analysis; Automotive electronics; Vibration environment; Failure; Lifecycle
• ISSN: 0923-8174; 1573-0727
• DOI: 10.1007/s10836-024-06099-6

The lifecycles of vehicular resistor lead in random vibration environment were analyzed in this technical note and the finite element model of a vehicular printed circuit board (PCB) was established. It is with two short edges of PCB fixed for boundary condition to simulate the actual working conditions of the vehicle driving on the road, the constrained modal analysis was simulated and experimental verification were carried out. Both the PCB and the vehicular resistor which soldered on PCB were excited vertically according to Standard GJB150. Based on simulated vibration excitation environment, the power spectral density (PSD) stress value of the resistor lead was calculated. The lifecycles of the resistor lead were calculated theoretically and were verified by following failure-oriented accelerated testing (FOAT). Finally, in order to extend the lifecycles of resistor lead, an improved solution for PCB is put forward.