Rate of Material Removal When Processing Titanium-Doped Sapphire

• Published in: Journal of superhard materials Vol. 45; no. 5; pp. 379 - 387
• Main Authors: Vovk, O. O., Voloshin, A. V., Slyunin, E. V., Voloshina, L. I., Kryvonogov, S. I., Nizhankovskyi, S. V.
• Format: Journal Article
• Language: English
• Published: Moscow Pleiades Publishing 01.10.2023; Springer Nature B.V
• Subjects: Chemistry; Chemistry and Materials Science; Crystal dislocations; Crystal structure; Crystal surfaces; Dislocation density; Grinding; Investigation of Machining Processes; Physical Chemistry; Sapphire; Surface roughness; Titanium; rate of material removal; grinding; chemical–mechanical polishing; mechanical polishing; surface roughness; sapphire; Ti:sapphire
• ISSN: 1063-4576; 1934-9408
• DOI: 10.3103/S1063457623050106

— The effect of the content of titanium ions in the crystals of titanium-doped sapphire (Ti:sapphire, up to 0.2 wt % Ti) on the rate of material removal and surface roughness at different stages of its processing was studied. It was established that the efficiency of material removal increases with an increase in the density of dislocations in the crystal. It was detected that with an increase in the content of titanium in Ti:sapphire during grinding with a fixed abrasive, the rate of material removal decreases, while in the case of grinding and polishing with a free abrasive, it increases due to a disordering of the crystal structure and deterioration of structural perfection of the crystals. Doping of sapphire with titanium leads to a decrease in the value of the crystal surface roughness parameter at a grinding stage.