Thermal Contact Resistance of the Copper–Copper Pair with Graphene Thermal Interface in Magnetic Fields up to 10 T

We investigate thermal contact resistance of a detachable connection in the copper–copper contact pair with a thermal interface made of graphene layers synthesized by chemical vapor deposition onto the contacting surface. The values of the thermal contact resistance of a detachable copper–graphene–c...

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Bibliographic Details
Published inPhysics of metals and metallography Vol. 124; no. 11; pp. 1105 - 1111
Main Authors Kolesov, K. A., Mashirov, A. V., Irzhak, A. V., Chichkov, M. V., Safrutina, E. F., Kiselev, D. A., Kuznetsov, A. S., Belova, O. V., Koledov, V. V., Shavrov, V. G.
Format Journal Article
LanguageEnglish
Published Moscow Pleiades Publishing 01.11.2023
Springer Nature B.V
Subjects
Chemical synthesis
Chemical vapor deposition
Chemistry and Materials Science
Contact resistance
Copper
Electrical and Magnetic Properties
Graphene
Heat transfer
Heat transmission
Magnetic fields
Materials Science
Metallic Materials
Thermal contact resistance
Thermal resistance
thermal contact resistance
thermal contact conductance
graphene
thermal interface
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Summary:We investigate thermal contact resistance of a detachable connection in the copper–copper contact pair with a thermal interface made of graphene layers synthesized by chemical vapor deposition onto the contacting surface. The values of the thermal contact resistance of a detachable copper–graphene–copper contact pair were obtained using the transient heat flow method in the temperature range of 15–150 K under the influence of an external magnetic field of up to 10 T.
ISSN:0031-918X
1555-6190
DOI:10.1134/S0031918X23601798