Suppression of Cu3Sn with Ni in High Cu Containing Sn-Cu Solder Alloys

This research examines the relationship between Cu and Ni concentration and the formation of primary Cu3Sn in high Cu containing Sn-Cu solder alloys. Through thermal analysis and optical microscopy, it was determined that Ni additions still have a significant effect in minimising or eliminating Cu3S...

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Bibliographic Details
Published inMaterials science forum Vol. 857; pp. 53 - 57
Main Authors Kefford, Benjamin, Read, Jonathan, McDonald, Stuart D., Nogita, Kazuhiro
Format Journal Article
LanguageEnglish
Published Pfaffikon Trans Tech Publications Ltd 01.05.2016
Subjects
High Temperature Solders
Cu6Sn5
Cu3Sn
Solidification
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Summary:This research examines the relationship between Cu and Ni concentration and the formation of primary Cu3Sn in high Cu containing Sn-Cu solder alloys. Through thermal analysis and optical microscopy, it was determined that Ni additions still have a significant effect in minimising or eliminating Cu3Sn for Cu concentrations as high as 30wt%. In addition, it is clear that a relationship exists between Cu concentration and the effect of Ni addition and the volume fraction of Cu3Sn increases as the Cu content increases. It is likely that the Ni addition has a significant effect on the interdiffusional coefficients of the diffusing species of Cu3Sn and Cu6Sn5, slowing the growth of Cu3Sn and encouraging primary Cu6Sn5 nucleation.
Bibliography:Selected peer reviewed papers from the 2015 International Conference on Advanced Materials Engineering and Technology (ICAMET 2015), December 4-5, 2015, Kaohsiung,Taiwan
ISSN:0255-5476
1662-9752
1662-9752
DOI:10.4028/www.scientific.net/MSF.857.53