Nondestructive Quantitative Analysis of Crack Propagation in Solder Joints

Nondestructive quantitative analysis has been developed and can reduce solder joint fatigue experiments by half the time. Additionally, the technique provides data that could shed some light on the dynamic behavior of solder joints under thermal cycles load. Statistical analysis of fatigue cracks�...

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Bibliographic Details
Published inIEEE transactions on components, packaging, and manufacturing technology (2011) Vol. 3; no. 8; pp. 1263 - 1270
Main Authors Gershman, Israel, Bernstein, Joseph B.
Format Journal Article
LanguageEnglish
Published IEEE 01.08.2013
Subjects
Crack
Electrical resistance measurement
fatigue
Monitoring
Noise measurement
propagation
Resistance
solder joint
Soldering
Statistical analysis
Temperature measurement
thermal cycles
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Summary:Nondestructive quantitative analysis has been developed and can reduce solder joint fatigue experiments by half the time. Additionally, the technique provides data that could shed some light on the dynamic behavior of solder joints under thermal cycles load. Statistical analysis of fatigue cracks' characteristics was performed based on solder joints that were monitored continuously during more than a thousand temperature cycles of -40/125 ° C. This paper presents the statistical analyses of solder joint and crack characteristics. A novel comparative criterion that was developed based on the nondestructive quantitative analysis of crack propagation in solder joints (NDQC) technique and presented here could be utilized in development stages of new technologies and save even more than 50% of testing time.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2013.2238673