Preparation of multi-wavelength infrared laser diode
We prepare a new type of multi-wavelength infrared laser diode with four chips, three wavelengths (865 nm, 905 nm and 1064 nm) and two working modes (pulse and single). The preparation technology of the diode includes two key processes: heat-sink and packaging processing technique to package four di...
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Published in | Optoelectronics letters Vol. 10; no. 3; pp. 194 - 197 |
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Main Author | |
Format | Journal Article |
Language | English |
Published |
Heidelberg
Tianjin University of Technology
01.05.2014
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Subjects | |
Online Access | Get full text |
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Summary: | We prepare a new type of multi-wavelength infrared laser diode with four chips, three wavelengths (865 nm, 905 nm and 1064 nm) and two working modes (pulse and single). The preparation technology of the diode includes two key processes: heat-sink and packaging processing technique to package four different chips on a same heat-sink. The experimental results show that four output peak-wavelengths of the prototype diode all possess favorable stability. |
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Bibliography: | 12-1370/TN XUE Ming-xi , CHEN Zhi-bin , WANG Wei-ming , LIU Xian-hong, SONG Yan , ZHANG Chao , and HOU Zhang-ya Shijiazhuang New Technology Application Institute, Mechanical Engineering College, Shijiazhuang 050003, China We prepare a new type of multi-wavelength infrared laser diode with four chips, three wavelengths (865 nm, 905 nm and 1064 nm) and two working modes (pulse and single). The preparation technology of the diode includes two key processes: heat-sink and packaging processing technique to package four different chips on a same heat-sink. The experimental results show that four output peak-wavelengths of the prototype diode all possess favorable stability. |
ISSN: | 1673-1905 1993-5013 |
DOI: | 10.1007/s11801-014-4019-5 |