Self-Aligned Double Patterning Aware Pin Access and Standard Cell Layout Co-Optimization

Self-aligned double patterning (SADP) is being considered for use at the 10-nm technology node and below for routing layers with pitches down to ~50 nm because it has better line edge roughness and overlay control compared to other multiple patterning candidates. To date, most of the SADP-related li...

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Bibliographic Details
Published inIEEE transactions on computer-aided design of integrated circuits and systems Vol. 34; no. 5; pp. 699 - 712
Main Authors Xiaoqing Xu, Cline, Brian, Yeric, Greg, Bei Yu, Pan, David Z.
Format Journal Article
LanguageEnglish
Published IEEE 01.05.2015
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Summary:Self-aligned double patterning (SADP) is being considered for use at the 10-nm technology node and below for routing layers with pitches down to ~50 nm because it has better line edge roughness and overlay control compared to other multiple patterning candidates. To date, most of the SADP-related literature has focused on enabling SADP-legal routing in physical design tools while few attempts have been made to address the impact SADP routing has on local, standard cell (SC) I/O pin access. At the same time, via layers are used to connect the local SADP routing layers to the I/O pins on lower metal layers. Due to the high via density on the Via-1 layer, the litho-etch-litho-etch (LELE)-aware Via-1 design becomes a necessity to achieve legal pin access at the SC level. In this paper, we present the first study on SADP-aware pin access and layout optimization at the SC level. Accounting for SADP-specific and Via-1 design rules, we propose a coherent framework that uses depth first search, mixed integer linear programming, and backtracking method to enable LELE friendly Via-1 design and simultaneously optimize SADP-based local pin access and within-cell connections. Our experimental results show that, compared with the conventional approach, our framework effectively improves pin access of the SCs and maximizes the pin access flexibility for routing.
ISSN:0278-0070
1937-4151
DOI:10.1109/TCAD.2015.2399439