Experimental Evaluation of the Effectiveness of the Printed Circuit Board Strain-Based Methodology in Space-Borne Electronics with Vertically Mounted Printed Circuit Boards

The Oh-Park methodology was proposed to overcome the limitations of Steinberg’s theory for evaluating the structural safety of space-borne electronics and has been experimentally verified at the printed circuit board (PCB) specimen level for various types of electronic packages, such as ball grid ar...

Full description

Saved in:
Bibliographic Details
Published inAerospace Vol. 11; no. 7; p. 562
Main Authors Kim, Kwang-Woo, Park, Jae-Hyeon, Park, Tae-Yong, Oh, Hyun-Ung
Format Journal Article
LanguageEnglish
Published Basel MDPI AG 01.07.2024
Subjects
Arrays
Ball grid packaging
bending mode
Boundary conditions
Circuit boards
critical strain
Electronics
Fatigue life
Fatigue tests
Housing
Printed circuit boards
Printed circuits
Random vibration
Satellites
solder joint
space-borne electronics
Strain
Structural analysis
Structural engineering
Structural safety
Online AccessGet full text

Cover

More Information
Summary:The Oh-Park methodology was proposed to overcome the limitations of Steinberg’s theory for evaluating the structural safety of space-borne electronics and has been experimentally verified at the printed circuit board (PCB) specimen level for various types of electronic packages, such as ball grid arrays (BGAs), column grid arrays (CGAs), and small-outline packages (SOPs). However, it is necessary to validate the design methodology because the PCB mounted on the housing is affected by the elastic mode of the mechanical housing. In addition, although the validity of the existing theory based on critical strain has been verified for horizontally mounted structures, there are cases where PCBs are mounted vertically. Therefore, it is essential to consider the dynamic influence of the boundary conditions of mounted electronics. In this study, electronics specimens with corresponding boundary conditions were fabricated, and a fatigue-life test was performed. In addition, a structural analysis using Steinberg’s theory and the Oh-Park methodology was performed, and the results were compared with those of the fatigue-life test. The results showed that the analysis using the Oh-Park methodology accurately represented the test results, and the validity of the Oh-Park methodology for vertical electronics was verified experimentally.
ISSN:2226-4310
2226-4310
DOI:10.3390/aerospace11070562