An Efficient Metal-Core Printed Circuit Board With a Copper-Filled Through (Blind) Hole for Light-Emitting Diodes

• Published in: IEEE electron device letters Vol. 34; no. 1; pp. 105 - 107
• Main Authors: Wu, Je-Yi, Chen, Chih-Ming, Horng, Ray-Hua, Wuu, Dong-Sing
• Format: Journal Article
• Language: English
• Published: IEEE 01.01.2013
• Subjects: Dielectrics; Heating; Light emitting diodes; Light-emitting diodes (LEDs); packaging; Thermal analysis; Thermal conductivity; Thermal resistance

A Cu-filled through (blind) hole was formed in a metal-core printed circuit board (MCPCB) by drilling a hole underneath the chip pad, followed by hole filling using copper electroplating. This Cu-filled through (blind) hole acts as a superior heat-dissipation route, which directly and efficiently re...